Asus Zenfone 3 ZE552KL vs Huawei Y9 (2018) Comparison and Differences

Smartphone 1

Asus Zenfone 3 ZE552KL

Asus Zenfone 3 ZE552KL

Smartphone 2

Huawei Y9 (2018)

Huawei Y9 (2018)

Smartphone 3

Asus Zenfone 3 ZE552KL or Huawei Y9 (2018) Specs Comparison

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Common specs

Brand and model Asus Zenfone 3 ZE552KL Huawei Y9 (2018)
Rating (+) (+)
Release date 2016, May 2018, March
Dimensions (HxWxD) 152.6 x 77.4 x 7.7 mm | 6.01 x 6.01 x 3.05 in 157.2 x 75.3 x 7.9 mm | 6.19 x 6.19 x 2.96 in
Weight 155 g | 5.47 oz 170 g | 6 oz
Body Build Front/back glass (Gorilla Glass), aluminum frame Front glass, aluminum body
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Colors Sapphire Black, Moonlight White, Shimmer Gold Black, Gold, Blue
Battery 3000 mAh,  Non-removable Li-Ion 4000 mAh,  Non-removable Li-Ion
Approximate price 330 EUR 220 EUR
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Screen

Technology Super IPS+ IPS LCD
Touchscreen capacitive touchscreen capacitive touchscreen
Display colors 16M 16M
Screen size 5.5" in 5.93" in
Screen area 83.4 cm2 90.7 cm2
Screen format 16:9 (height:width) 18:9 (height:width)
Screen to body ratio 70.6% 76.7%
Screen resolution 1080 x 1920 px 1080 x 2160 px
Screen PPI /points per inch/ 401 PPI 407 PPI
Screen protection Corning Gorilla Glass 3
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Camera and Video

Rear camera, main 16 MP, Single 16 MP, Dual
Camera specs -16 MP, f/2.0, 3-axis OIS, PDAF & laser AF -16 MP, f/2.2, 27mm (wide), PDAF
-2 MP, depth sensor
Functions Dual-LED dual-tone flash, panorama, HDR LED flash, panorama, HDR
Video 2160p@30fps 1080p@30fps
Front camera, selfie 8 MP, Single 13 MP, Dual
Specifications 8 MP, f/2.0 13 MP, f/2.0, 26mm (wide)
2 MP, depth sensor
Video 1080p@30fps 1080p@30fps

Performance

Operating system - OS Android 6.0.1 (Marshmallow), upgradable to 7.0 (Nougat); ZenUI 3 Android 8.0 (Oreo); EMUI 8
Chipset - Qualcomm MSM8953 Snapdragon 625 (14 nm) - HiSilicon Kirin 659 (16 nm)
CPU - Octa-core 2.0 GHz Cortex-A53 - Octa-core (4x2.36 GHz Cortex-A53 & 4x1.7 GHz Cortex-A53)
GPU Adreno 506 Mali-T830 MP2
External memory microSD, up to 256 GB (uses SIM 2 slot) microSD, up to 256 GB (dedicated slot)
Internal memory 64 GB, 4 GB RAM 32 GB, 3 GB RAM 64/128 GB, 4 GB RAM 32 GB, 3 GB RAM

Benchmark

Antutu 7 Total
GeekBench 6 Single Core 190
GeekBench 6 Multi Core 825

Communication and Connectivity

SIM card Hybrid Dual SIM (Nano-SIM/ Micro-SIM, dual stand-by) Dual SIM (Nano-SIM, dual stand-by)
Network GSM / HSPA / LTE GSM / HSPA / LTE
Bands -2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
-3G - HSDPA 850 / 900 / 1900 / 2100 - Global 
HSDPA 850 / 900 / 1900 / 2100 / 800 - Taiwan 
HSDPA 850 / 900 / 2100 - India 
HSDPA 850 / 900 / 1700(AWS) / 1900 / 2100 - USA/Brazil
-4G - LTE band 1(2100), 2(1900), 3(1800), 5(850), 7(2600), 8(900), 20(800) - Global 
LTE band 1(2100), 2(1900), 3(1800), 5(850), 7(2600), 8(900), 18(800), 19(800), 26(850), 28(700), 38(2600), 39(1900), 40(2300), 41(2500) - Taiwan 
LTE band 1(2100), 3(1800), 5(850), 8(900), 40(2300) - India 
LTE band 1(2100), 2(1900), 3(1800), 4(1700/2100), 5(850), 7(2600), 8(900), 17(700), 28(700) - USA/Brazil
-2G - GSM 850 / 900 / 1800 / 1900 - SIM 1 & SIM 2
-3G - HSDPA 850 / 900 / 1900 / 2100
-4G - LTE
Speed HSPA 42.2/5.76 Mbps, LTE Cat4 150/50 Mbps (Global), LTE-A (2CA) Cat6 300/50 Mbps (Taiwan) HSPA 42.2/5.76 Mbps, LTE-A (2CA) Cat6 300/50 Mbps
GPRS Yes Yes
Edge Yes Yes
Wi-Fi Wi-Fi 802.11 a/b/g/n/ac, Wi-Fi Direct, hotspot Wi-Fi 802.11 b/g/n, Wi-Fi Direct, hotspot
GPS Yes, with A-GPS, GLONASS Yes, with A-GPS, GLONASS, BDS
NFC
USB 2.0, Type-C 1.0 reversible connector microUSB 2.0
Bluetooth 4.2, A2DP, EDR, LE 4.2, A2DP, LE, aptX

Music and Audio

Radio FM radio FM radio
Headphone jack Yes Yes
Others - 24-bit/192kHz audio - Active noise cancellation with dedicated mic

Other features

Sensors - Fingerprint (rear-mounted), accelerometer, gyro, proximity, compass - Fingerprint (rear-mounted), accelerometer, gyro (market dependent), proximity, compass
Other extras
Versions
- Also known as Huawei Enjoy 8 Plus in China

Reviews and Opinions on Asus Zenfone 3 ZE552KL and Huawei Y9 (2018)

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