iiiF150 B1 vs iiiF150 R2022 Comparison and Differences

Smartphone 1

iiiF150 B1

iiiF150 B1

Smartphone 2

iiiF150 R2022

iiiF150 R2022

Smartphone 3

iiiF150 B1 or iiiF150 R2022 Specs Comparison

or

Common specs

Brand and model iiiF150 B1 iiiF150 R2022
Rating (+0) (+0)
Release date August, 2022 September, 2021
Dimensions (HxWxD) 171.0 x 81.6 x 16.7 mm | 6.73 x 6.73 x 3.21 in 170.5 x 82.5 x 15.5 mm | 6.71 x 6.71 x 3.25 in
Weight 356 g | 12.56 oz 350 g | 12.35 oz
Body Build Rugged Smartphone, Plastic, Magnesium alloy Rugged Smartphone, Plastic
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Colors Tough, Black Black, White, Sand
Battery 10000 mAh, Li-Polymer, non-removable 8300 mAh, Li-Polymer, non-removable
Approximate price
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Screen

Technology LCD IPS LCD IPS
Touchscreen capacitive touchscreen capacitive touchscreen
Display colors 16M 16M
Screen size 6.5" in 6.78" in
Screen area
Screen format 20:9 (height:width) 21:9 (height:width)
Screen to body ratio 73% 77%
Screen resolution 1080 x 2400 px 1080 x 2460 px
Screen PPI /points per inch/ 405 PPI 396 PPI
Screen protection Corning Gorilla Glass Corning Gorilla Glass 3
Other specs - 580 nits (typ)
-90 Hz
-Touch 180 Hz
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Camera and Video

Rear camera, main 20 MP, Triple 64 MP, Triple
Camera specs -20 MP, Unknow, (wide),
-2 MP, ƒ/ 2.4, (depth),
-2 MP, (macro)
-64 MP, ƒ/ 1.8, (wide), 0.70 µm
-20 MP, ƒ/ 1.8, (wide), 1.00 µm
-2 MP, 1/5, (macro), 1.75 µm
Functions Triple LED flash LED flash
Video 1080p video 1080p video, Slow Motion 120 fps
Front camera, selfie 16 MP, Single 16 MP, Single
Specifications 16 MP, ƒ/ 2.8, 1.00 µm, 1/3.1 16 MP, ƒ/ 2.0

Performance

Operating system - OS Android 12 Snow Cone Android 11 Red Velvet Cake
Chipset - MediaTek Helio G37 (12 nm) - MediaTek Helio G95 (MT6785V/CD) (12 nm)
CPU - Octa-Core (8x2.3GHz Cortex A53) - Octa-Core (2x2.05 GHz Cortex A76 + 6x2.0 GHz Cortex A55)
GPU PowerVR GE832 ARM Mali-G76 MC4
External memory microSDXC (uses shared SIM slot) microSDXC (dedicated slot)
Internal memory 6GB 64GB, 6GB · 64GB 6GB · 128GB · Pro 8GB 128GB, 8GB · 128GB

Benchmark

Antutu 9 Total 135001 320008
GeekBench 5 Single Core 427
GeekBench 5 Multi-Core 1550

Communication and Connectivity

SIM card Dual SIM, dual stand-by (Nano SIM + Nano SIM) Dual SIM, dual stand-by (Nano SIM + Nano SIM)
Network 2G / 3G / 4G / 2G / 3G / 4G /
Bands -2G - B2 (1900), B3 (1800), B5 (850), B8 (900)
-3G - B1 (2100), B8 (900)
-4G - B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
-2G - B2 (1900), B3 (1800), B5 (850), B8 (900)
-3G - B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
-4G - B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
Speed
GPRS Yes Yes
Edge Yes Yes
Wi-Fi 802.11a, 802.11b, 802.11g, 802.11n, 802.11n 5GHz, 802.11ac,Dual band ,Wi-Fi Hotspot ,Wi-Fi Direct ,Wi-Fi Display 802.11a, 802.11b, 802.11g, 802.11n, 802.11n 5GHz, 802.11ac,Dual band ,Wi-Fi Hotspot ,Wi-Fi Direct ,Wi-Fi Display
GPS GPS, A-GPS, GLONASS, Beidou, Galileo GPS, A-GPS, GLONASS, Beidou
NFC Yes Yes
USB Yes, USB Type C, USB On-The-Go (OTG) Yes, USB Type C, USB On-The-Go (OTG)
Bluetooth Bluetooth 5.0, A2DP Bluetooth 5.0, A2DP

Music and Audio

Radio Yes Yes
Headphone jack No Yes

Other features

Sensors - Fingerprint (side-mounted), Proximity, Accelerometer, compass, gyro , Infrared port - Fingerprint (side-mounted), Proximity, Accelerometer, compass, gyro , Infrared port
Other extras
- Fast charging 18.0W
- IP68, MIL-STD-810G
-IP69K

- IP68, MIL-STD-810G
-IP69K

Reviews and Opinions on iiiF150 B1 and iiiF150 R2022

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